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A2F200M3F-FGG256I
Opis:
A2F200M3F-FGG256I datasheet pdf and Embedded - System On Chip (SoC) product details from Microsemi stock available at Rozee
Kategoria:
Obwody zintegrowane
Specyfikacje
Part Number:
A2F200M3F-FGG256I
Manufacturer:
Microsemi
Description:
In stock. Alternative models available.
Lifecycle:
New from this manufacturer
Delivery:
DHL、UPS、FedEx、Registered Mail
Payment:
T/T Paypal Visa Western Union
More Information:
A2F200M3F-FGG256I More Information
ECAD:
Request Free CAD Models
Pricing(USD):
$48.99
Remark:
Manufacturer: Microsemi.
Rozee is one of the Distributors.
Wide range of applications.
Data Rate:
400 kbps
Interface:
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Memory Size:
4.5 kB
Case/Package:
FBGA
Number of I/Os:
117
Number of Gates:
200000
Max Supply Voltage:
1.575 V
Operating Supply Current:
7 mA
Max Operating Temperature:
100 °C
Number of Logic Elements/Cells:
2500
Products Category:
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Qty:
3952 In Stock
Applications:
Datacom module
Industrial transport (non-car & non-light truck)
Frequency:
80 MHz
Schedule B:
8542310000
Peripherals:
DMA, POR, WDT
Max Frequency:
100 MHz
Number of Pins:
256
Core Architecture:
ARM
Min Supply Voltage:
1.425 V
Operating Supply Voltage:
1.5 V
Min Operating Temperature:
-40 °C
Numer modelu:
A2F200M3F-FGG256I
Wprowadzenie
A2F200M3F-FGG256I Overview\\\\nA2F200M3F-FGG256I is a model belonging to the Embedded - System On Chip (SoC) subcategory under Integrated Circuits (ICs). For specific product performance parameters, please refer to the data sheet, such as PDF files Docx documents, etc. We have A2F200M3F-FGG256I high-definition pictures and data sheets for reference. We will continue to produce various video files and 3D models for users to understand our product more intuitively and
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