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TLV2761IP

Opis:
TLV2761IP datasheet pdf and Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product details from Rochester Electronics stock available at Rozee
Kategoria:
Obwody zintegrowane
Specyfikacje
Part Number:
TLV2761IP
Manufacturer:
Rochester Electronics
Description:
In stock. Alternative models available.
Lifecycle:
New from this manufacturer
Delivery:
DHL、UPS、FedEx、Registered Mail
Payment:
T/T Paypal Visa Western Union
More Information:
TLV2761IP More Information
ECAD:
Request Free CAD Models
Pricing(USD):
$0.75
Remark:
Manufacturer: Rochester Electronics. Rozee is one of the Distributors. Wide range of applications.
Width:
6.35 mm
Length:
9.81 mm
Packaging:
Rail/Tube
Thickness:
3.9 mm
Voltage Gain:
101.58 dB
Output Current:
10.2 mA
Power Dissipation:
1.2 W
Max Supply Voltage:
3.6 V
Number of Channels:
1
Number of Elements:
1
Nominal Supply Current:
28 µA
Min Dual Supply Voltage:
800 mV
Max Operating Temperature:
85 °C
Input Offset Voltage (Vos):
3.5 mV
Common Mode Rejection Ratio:
50 dB
Products Category:
Integrated Circuits (ICs) - Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Qty:
7091 In Stock
Applications:
Datacom module Data storage Portable electronics
Height:
5.08 mm
Bandwidth:
500 kHz
Slew Rate:
0.2 V/µs
Case/Package:
PDIP
Number of Pins:
8
Max I/O Voltage:
3.5 mV
Input Bias Current:
15 pA
Min Supply Voltage:
1.8 V
Number of Circuits:
1
Gain Bandwidth Product:
500 kHz
Max Dual Supply Voltage:
1.8 V
Operating Supply Current:
20 µA
Min Operating Temperature:
-40 °C
Output Current per Channel:
10.2 mA
Nominal Gain Bandwidth Product:
500 kHz
Numer modelu:
TLV2761IP
Wprowadzenie
TLV2761IP Overview\\\\nTLV2761IP is a model belonging to the Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps subcategory under Integrated Circuits (ICs). For specific product performance parameters, please refer to the data sheet, such as PDF files Docx documents, etc. We have TLV2761IP high-definition pictures and data sheets for reference. We will continue to produce various video files and 3D models for users to understand our product more intuitively and
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