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MCP606-I/SN

Opis:
MCP606-I/SN datasheet pdf and Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product details from Roving Networks / Microchip Technology stock available at Rozee
Kategoria:
Obwody zintegrowane
Specyfikacje
Part Number:
MCP606-I/SN
Manufacturer:
Roving Networks / Microchip Technology
Description:
In stock. Alternative models available.
Lifecycle:
New from this manufacturer
Delivery:
DHL、UPS、FedEx、Registered Mail
Payment:
T/T Paypal Visa Western Union
More Information:
MCP606-I/SN More Information
ECAD:
Request Free CAD Models
Pricing(USD):
$0.76
Remark:
Manufacturer: Roving Networks / Microchip Technology. Rozee is one of the Distributors. Wide range of applications.
Mount:
Surface Mount
Height:
1.2446 mm
Bandwidth:
155 kHz
Slew Rate:
0.08 V/µs
Voltage Gain:
121 dB
Number of Pins:
8
Max Input Voltage:
6 V
Input Bias Current:
80 pA
Min Supply Voltage:
2.5 V
Number of Circuits:
1
Number of Amplifiers:
1
Nominal Supply Current:
25 µA
Max Operating Temperature:
85 °C
Input Offset Voltage (Vos):
250 µV
Power Supply Rejection Ratio (PSRR):
80 dB
Products Category:
Integrated Circuits (ICs) - Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Qty:
9123 In Stock
Applications:
Appliances Enterprise machine
Width:
3.9116 mm
Length:
4.8768 mm
Packaging:
Rail/Tube
Case/Package:
SOIC
Max Frequency:
1 kHz
Output Current:
17 mA
Min Input Voltage:
2.5 V
Max Supply Voltage:
6 V
Number of Channels:
1
Number of Elements:
1
Gain Bandwidth Product:
155 kHz
Operating Supply Voltage:
5.5 V
Min Operating Temperature:
-40 °C
Common Mode Rejection Ratio:
75 dB
Numer modelu:
MCP606-I/SN
Wprowadzenie
MCP606-I/SN Overview\\\\nMCP606-I/SN is a model belonging to the Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps subcategory under Integrated Circuits (ICs). For specific product performance parameters, please refer to the data sheet, such as PDF files Docx documents, etc. We have MCP606-I/SN high-definition pictures and data sheets for reference. We will continue to produce various video files and 3D models for users to understand our product more intuitively and
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